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Union Butterfield® 46204933 1681AP 1/2-13 APPLIX MXR PM THREAD FORMER SEMI-BOT LEAD TiN TOP 2B
Union Butterfield® 46204933 1681AP 1/2-13 APPLIX MXR PM THREAD FORMER SEMI-BOT LEAD TiN TOP 2B
SKU715050
MFGR #6204933
Your Cost: $55.78/ea
List: UNB 46204933 1681AP 1/2-13 APPLIX MXR PM THREAD FORMER SEMI-BOT LEAD TiN TOP 2B
UNB 46204933 1681AP 1/2-13 APPLIX MXR PM THREAD FORMER SEMI-BOT LEAD TiN TOP 2B
Catalog Number 6204933 Chamfer Type Semi-Bottoming Class of Fit 2B Cutting Direction Right Hand Finish|Coating TiN Coated Gross Weight Per Pack 0.1500 lb Material HSS-PM Measurement System Imperial Overall Length 4.331 in Series 1681AP Applix MXR Shank Diameter 0.367 in Square Size 0.275 in Standards ANSI/DIN Specified Thread Length 0.984 in Thread Standard UNC Type High Performance UPC 11 69846442358 Stock Status NONSTOCK Brand Dormer Pramet Manufacturer Dormer Pramet Thread Limit H8 Thread Size 1/2-13 Premium PM substrate provides superior abrasion resistance and edge strength Multiple lube groove design assures lubrication in the forming zone and eliminates the build-up of hydraulic pressure in blind holes The TiN top coating process reduces friction, prevents chip welding and improves chip flow
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Catalog Number | 6204933 |
Chamfer Type | Semi-Bottoming |
Class of Fit | 2B |
Cutting Direction | Right Hand |
Finish|Coating | TiN Coated |
Gross Weight Per Pack | 0.1500 lb |
Material | HSS-PM |
Measurement System | Imperial |
Overall Length | 4.331 in |
Series | 1681AP Applix MXR |
Shank Diameter | 0.367 in |
Square Size | 0.275 in |
Standards | ANSI/DIN Specified |
Thread Length | 0.984 in |
Thread Standard | UNC |
Type | High Performance |
UPC 11 | 69846442358 |
Stock Status | NONSTOCK |
Brand | Dormer Pramet |
Manufacturer | Dormer Pramet |
Thread Limit | H8 |
Thread Size | 1/2-13 |
Premium PM substrate provides superior abrasion resistance and edge strength |
Multiple lube groove design assures lubrication in the forming zone and eliminates the build-up of hydraulic pressure in blind holes |
The TiN top coating process reduces friction, prevents chip welding and improves chip flow |