nVent HOFFMAN SPDS2006 Separation Plate, 75.04 in H x 0.49 in W x 19.92 in D, For Use With 600 mm D x 2000 mm H MCSS/MCDS/ECOM Combinable Floor Standing Enclosures, 16 ga Mild Steel
Modular Enclosure Internal Components
PDW~14194611
MFG #: SPDS2006
nVent HOFFMAN
402.00000
/ ea
- Application: Controls and Drives; Factory Automation and Process Control
- ARRA Compliant: C
- Buy American Compliant: C
- Catalog Number: SPDS2006
- Color: Unpainted
- Consist Of: Separation Plates, MCSS, MCDS Enclosures; Mounting Components and Instruction Manual
- Construction: 16 gauge
- Country of Origin: RO
- Currency: USD
- EU RoHS Indicator: C
- Gross Volume Per Pack: 8.79
- Gross Weight Per Pack: 26.4600 lb
- Gross Weight per Pack Metric: 12.00
- Gross Weight UOM Metric: kg
- Harmonization Tariff Schedule Code: 9403999045
- Height [Metric]: 20.3200 cm
- Item Group: FCSY
- Length: 79.12 in
- Length [Metric]: 200.9648 cm
- Returnable: Y
- Size: 75.04 x 0.49 x 19.92 inch
- Type: IEC Enclosure Accessories
- UNSPSC: 39121334
- UPC 11: 78351052845
- UPC 12: 783510528454
- Width [Metric]: 60.9600 cm
- Brand: nVent HOFFMAN
- Manufacturer: HOFFMAN ENCLOSURES
- Height: 8.00 in
- Material: Mild Steel
- Width: 24.00 in
nVent HOFFMAN Separation Plate, Series: SPDS, 0.49 in Width, 19.92 in Depth, 75.04 in Height, For Use With: 600 mm D x 2000 mm H MCSS/MCDS/ECOM Combinable Floor Standing Enclosures, 16 ga Mild Steel, Zinc Plated, Unpainted
- Applications
- Features
| Controls and Drives; Factory Automation and Process Control |
| The new Separation Plate divides bayed stainless steel enclosures without decreasing the IP rating, creating individual spaces for components to be mounted |
| Separation plate compatible with stainless steel combinable floor standing enclosures |
| The plate can be mounted easily between two bayed enclosures providing segregation, protection degree IP43 tested, when mounted with the Separation Plate gasket, SPDG |
| The enclosure assembly can be easily segregated creating individual spaces for components to be mounted |
| These areas are commonly used to group component types, for example power in one section and control in another |
| These spaces can also be used when some components are more sensitive to temperature than others, allowing better control of the enclosures thermal management |
| Separates two bayed MCSS/MCDS/ECOM enclosures |